DUBLIN, Nov. 6, 2019 /PRNewswire/ -- The "Global Semiconductor Silicon Wafer Market" report has been added to ResearchAndMarkets.com's offering. This report forecasts the market for compound ...

Strategic partnership kicks off with installation of EVG850 automated laser debonding system at the newly launched Center for Advanced CMOS and Heterointegration Saxony (CEASAX) Kicking off this ...

Wafer-to-wafer bonding is an essential process step to enable 3D devices such as stacked DRAM, memory-on-logic and future CMOS image sensors. At the same time, minimizing the dimensions of TSVs, which ...

Resonac is looking for development partners to establish a new debonding process, as well as to market the new temporary bonding film. In the front-end and back-end processes of advanced ...

A recent technical paper titled “Factors determining bond wave speed in wafer bonding” was published by researcher at Yokohama National University, Tokyo Electron Kyushu Limited and ANVOS Analytics.

Hybrid bonding has been in production for several years, with mature flows capable of delivering robust yields using 10µm interconnects. At that scale, processes can tolerate hundreds of nanometers of ...

This higher density of circuitry on a wafer requires greater accuracy and a highly fragile and advanced fabrication process. Several newer and highly complex ICs today are made of a dozen or more ...

New Monolithic Lens Molding (MLM) capability enables up to eight-megapixel-and-higher-resolution devices. CHIBA, Japan, Dec. 1, 2010 /PRNewswire/ -- SEMICON JAPAN -- EV Group (EVG), a leading supplier ...

“Our 200-mm EVG850LT system has been instrumental in helping us fulfill customer requirements for high-performance SOI wafers,” stated Prof. He ZhiQiang, CEO of SST. “As we look to advance our ability ...

Hybrid bonding is becoming more critical for advanced semiconductor packaging, thanks to its ability to enable high-density interconnects inside complex 3D assemblies. This approach involves the ...